MATSCEN 5552
Transcript Abbreviation:
Nano Elec. Matl.
Course Description:
Processing, structure and stability of materials in micro(nano)electronics. Thin film epitaxy, semiconductor heterostructures, quantum confinement, bandgap engineering, electronic properties of defects, nanolithography, self-assembled nanostructures.
Course Levels:
Undergraduate (1000-5000 level)
Graduate
Designation:
Elective
General Education Course
(N/A)
Cross-Listings
(N/A)
Credit Hours (Minimum if “Range”selected):
3.00
Max Credit Hours
(N/A)
Select if Repeatable:
Off
Maximum Repeatable Credits
(N/A)
Total Completions Allowed
(N/A)
Allow Multiple Enrollments in Term:
No
Course Length:
14 weeks (autumn or spring)
12 weeks (summer only)
Off Campus:
Never
Campus Location:
Columbus
Instruction Modes:
In Person (75-100% campus; 0-24% online)
Prerequisites and Co-requisites:
Prereq: 3141 and 3271, or permission of instructor.
Electronically Enforced:
No
Exclusions:
Not open to students with credit for 676.
Course Goals / Objectives:
Introduce the processing, structure and stability of materials in micro(nano)electronics; Students will learn the technology involved in silicon processing, design of process flow, engineering aspects of nano-micro-fabrication
Introduce thin film epitaxy and semiconductor heterostructures engineering
Introduce quantum confinement and bandgap engineering in modern electronic and optical materials
Introduce the electronic properties of defects, nanolithography techniques, and self-assembled nano-structures
Check if concurrence sought:
No
Contact Hours:
| Topic | LEC | REC | LAB | LAB Inst |
|---|---|---|---|---|
| Introduction and Review: Materials in electronic devices; their role/function in the devices; overview electronic materials. | 1.5 | 0.0 | 0.0 | 0 |
| Crystal Growth and Defects [electronic properties of defects] | 4.5 | 0.0 | 0.0 | 0 |
| Nanolithography and Etching [photolithography and nanolithography: e-beam, dip pen] | 3.0 | 0.0 | 0.0 | 0 |
| Thermal Oxidation | 3.0 | 0.0 | 0.0 | 0 |
| Solid-State Diffusion | 3.0 | 0.0 | 0.0 | 0 |
| Metallization and Solid-Solid Reactions | 3.0 | 0.0 | 0.0 | 0 |
| Ion Implantation & Ion-Solid Interactions | 3.0 | 0.0 | 0.0 | 0 |
| Device Packaging & Yield; process integration | 3.0 | 0.0 | 0.0 | 0 |
| Materials for non-Si devices vs. Si-based devices | 3.0 | 0.0 | 0.0 | 0 |
| Band gap engineering in compound semiconductors and oxides | 3.0 | 0.0 | 0.0 | 0 |
| Introduction to heterostructures: electronic properties at solid-solid interfaces, quantum confinement effects for nanoelectronics and photonics. | 3.0 | 0.0 | 0.0 | 0 |
| Thin film epitaxy: alloying, lattice matching, strain accommodation, strain relaxation in heterostructures. Misfit and threading dislocations | 3.0 | 0.0 | 0.0 | 0 |
| Self-assembled nanostructures: nanowires, quantum dots. | 3.0 | 0.0 | 0.0 | 0 |
| Final design project | 3.0 | 0.0 | 0.0 | 0 |
| Total | 42 | 0 | 0 | 0 |
Grading Plan:
Letter Grade
Course Components:
Lecture
Grade Roster Component:
Lecture
Credit by Exam (EM):
No
Grades Breakdown:
| Aspect | Percent |
|---|---|
| Weekly quizzes | 25% |
| Mid-term Exams (or Homework) | 30% |
| Student presentation on modern processing topics | 20% |
| Final Design Project | 25% |
Representative Textbooks and Other Course Materials:
| Title | Author | Year |
|---|---|---|
| No Textbooks and Other Course Materials Entered. | ||
ABET-CAC Criterion 3 Outcomes
(N/A)
ABET-ETAC Criterion 3 Outcomes
(N/A)
ABET-EAC Criterion 3 Outcomes:
| Outcome | Contribution | Description |
|---|---|---|
| 1 | Significant contribution (7+ hours) | an ability to identify, formulate, and solve complex engineering problems by applying principles of engineering, science, and mathematics |
| 2 | Substantial contribution (3-6 hours) | an ability to apply engineering design to produce solutions that meet specified needs with consideration of public health, safety, and welfare, as well as global, cultural, social, environmental, and economic factors |
| 5 | Some contribution (1-2 hours) | an ability to function effectively on a team whose members together provide leadership, create a collaborative and inclusive environment, establish goals, plan tasks, and meet objectives |
| 6 | Some contribution (1-2 hours) | an ability to develop and conduct appropriate experimentation, analyze and interpret data, and use engineering judgment to draw conclusions |
| 7 | Some contribution (1-2 hours) | an ability to acquire and apply new knowledge as needed, using appropriate learning strategies |
Embedded Literacies Info
(N/A)
Attachments
(N/A)
Additional Notes or Comments
(N/A)